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FOR IMMEDIATE RELEASE No. 3044
Optimal low power solution for high-grade energy-efficient air conditioners
TOKYO, August 17, 2016 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today the launch of a new transfer-mold power semiconductor model in its lineup of Super-mini Dual-In-line Package Intelligent Power Modules (DIPIPM™), embedded with Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistors (SiC-MOSFET). It will launch on August 17.
Model | Specification | Shipment |
---|---|---|
PSF15S92F6 | 15A/600V | August 17, 2016 |
Note that the releases are accurate at the time of publication but may be subject to change without notice.